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UniTemp GmbH. Entwicklung und Vertrieb von Geräten für die Mikroelektronik (Halbleiter)
www.lecksucher.com - 2009-02-07
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UniTemp GmbH. Entwicklung und Vertrieb von Geräten für die Mikroelektronik (Halbleiter)
www.unitemp.de - 2009-02-07
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DuPont offers a growing portfolio of semiconductor packaging materials. New materials solutions span wafer level packaging, including wafer bumping, TSV, 3D, ...
packaging-circuits.dupont.com - 2009-04-11
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Welcome to ProTek Devices. ProTek offers transient voltage protection solutions for a world of applications.
protek devices 
www.protekdevices.com - 2009-02-07
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A free, neutral source providing micropackaging tutorials,articles, abstracts, technology updates, photographs, newsletter, supplier directory
bumped wafers chipscale package flip chip abstracts flip chip articles flipchip articles flip chip information flipchip information flip chip literature
www.flipchips.com - 2009-02-04
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Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
Dr Tresky Dr Tresky AG Microsystemtechnic
www.tresky.com - 2009-02-05
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AuleeTech conducts Trainings and Maintenance for the Semiconductor Flip-Chip Industry. We sell second hand spare parts/equipment. Micron2 (ESEC), Micron5003 ...
Micron 2 Micron5003 Micron 5003 Powatech Wafer magazines
www.auleetech.com - 2009-02-08
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SiPkg Home
www.sipkg.com - 2009-02-07
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high-precision assembly equipment for the advanced packaging market; specialist in the field of RFID, Flip Chip, System in Package (SIP), MCM, CMOS, Die Bonding
thin die handling
www.datacon.at - 2009-02-08
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Same day packaging and custom assembly services. Utilize your own proprietary packaging designs.
die thinning ic prototypes open cavity plastic package wafer preparation
www.icproto.com - 2009-02-13
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